Powerful physical package implementation


Key Benefits

   •   Operational efficiency and user flexibility with highly scalable systems

   •   Advanced compiler, predictable runtime, and debug capabilities

   •   Supports a full front-to-back physical implementation flow

  
With true integration with IC development in a physical co-design environment, Cadence®
Allegro® Package Designer has complete package implementation capabilities to help you
make strategic tradeoffs earlier and with greater confidence.


                                  Cadence Allegro Package Designer
  

 Allegro Package Designer enables constraint-driven substrate interconnect design, extraction,
modeling, and signal integrity analysis. The final design output provides automatic system-level
handoffs for PCB design in the form of a PCB footprint and schematic symbol.


Features

   •   Supports a full front-to-back physical implementation flow for IC package design

   •   Determines the best package and substrate options early in the IC design cycle

   •   Provides comprehensive design rule and electrical constraint-driven layout

   •   Incorporates design for manufacturing (DFM) methodologies 

   •   Improves design flow with intrinsic support for all industry standards 

   •   Models entire design in 3D with the optional Cadence 3D Design Viewer