| |
Fast and accurate electrical analysis of full IC packages or PCBs
Key Benefits
• Fast and accurate signal/power integrity and design-stage EMI analysis,
S-parameter model extraction, and frequency domain simulation
• Tried and proven technology and supports large designs
• Interfaces to Cadence and other vendor layout databases
To help you tackle increasingly challenging issues related to simultaneous switching
noise, signal coupling, and target voltage levels, Cadence® Sigrity™ PowerSI®
technology provides fast, accurate, and detailed electrical analysis of full IC packages
or PCBs. It is cloud ready and can be used pre-layout to develop power- and
signal-integrity guidelines, as well as post-layout to verify performance and improve
a design without needing a prototype.
Using Sigrity PowerSI electromagnetic (EM) field solver technology, you can readily
perform a broad range of studies to identify trace and via coupling issues,
power/ground fluctuations caused by simultaneously switching outputs, and design
regions that are under or over voltage targets. PowerSI technology also lets you
perform extraction of frequency-dependent network parameter models and lets you
visualize complex spatial relationships.
Features
• Facilitates AC analysis to assess voltage distribution across ground planes
• Establishes power delivery network (PDN) guidelines for IC packages and boards
• Evaluates electromagnetic coupling between geometries to enable better
component, via, and decap placement
• Extracts frequency-dependent S, Z, and Y parameters for package and board
modeling for subsequent time domain SSN simulation
• Anticipates energy leaks with near-field ration display
• Assesses decoupling capacitor strategies and verifies placement effects Enables
broadband modeling including accurate DC performance characterization (patent
pending)
• Integrates seamlessly with 3D solutions for IC packages and boards
• Distributed computing option accelerates analysis time (additional license required)
• Strong HSPICE flow support
• Optimized for flows with Cadence SiP Layout, Allegro® Package Designer, and Allegro
PCB Designer
• Readily used in Mentor, Zuken, and Altium flows, accepting a mix of CAD databases
where needed for multi-structure design support
|
