Build models more than 10X faster


Key Benefits

   •   Helps you build accurate RLC IBIS or SPICE models more than 10X faster
        than alternate approaches

   •   Unique assessment capabilities quickly identify potential package
        performance issues

   •   Supports broadband multi-stage optimized models and multiple package
        types
  

To help you create accurate, RLC, IBIS or SPICE IC package electrical models up to
10 times faster than alternative approaches, Cadence® Sigrity™ XtractIM™
technology uses hybrid solvers. With these hybrid-solver-derived models you can
perform system-level signal and power integrity simulations by including drivers,
receivers, and other interconnects. An option to generate broadband-optimized
models is included.


Sigrity XtractIM technology gives you electrical models of IC packages in IBIS or
SPICE circuit netlist format. These concise parasitic models can be per pin/net RLC
list, coupled matrices, or Pi/T SPICE sub-circuits.


The technology’s broadband-optimized multi-stage models mean you can verify its
accuracy over a specific frequency range and fill a gap between IBIS/RLGC and
full-wave S-parameters. Whether you’re a casual or frequent user, the tool is readily
accessible with an easy-to-use workflow helps you set up tasks such as stackup
checking, C4 bump and solder ball creation, and signal and power/ground net
selection, as well as defining other extraction parameters.
  


 
  
Features

   •   Visualizes potential package performance issues

   •   Extracts models of entire packages or selected nets

   •   First-ever package assessment visualization to rapidly pinpoint potential risks
        and avoid the needle-in-haystack issue

   •   Flexible pin-grouping options to enable the user-preferred model resolution

   •   Comprehensive extraction of the entire design, including embedded passive
        components

   •   Compact broadband models (2% S-parameter model size) with time domain
        circuit simulation compatibility

   •   Flexible 2D/3D visualization, plotting, and spreadsheet data management

   •   Optimized to read physical design data from Cadence package design tools

   •   Readily used with Mentor or Zuken package databases