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  Flex Logix Technologies, Inc.,  
 

Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP

 
 
 
 

                                  

  Global Unichip Corporation and Flex
   
    Logix Achieve First-Time Working
   
   Silicon on Joint ASIC Development
   
  Using EFLX Embedded FPGA (eFPGA)
   
                              IP



Another successful tape-out signals the maturity of eFPGA for
    
                  ASICs requiring RTL reconfigurability



MOUNTAIN VIEW, Calif. – February 8, 2021 – Flex Logix®
Technologies, Inc., supplier of the fastest and most-efficient AI
edge inference accelerator and the leading supplier of eFPGA IP,
and Global Unichip Corporation (GUC), the advanced ASIC leader,
today announced that they have successfully taped out with
first-time working silicon using the EFLX® eFPGA IP.  SoC
designers can have high confidence in using EFLX eFPGA and GUC
to meet their chip eFPGA requirements.


Portable and Scalable eFPGA to Meet Customer
Requirements

eFPGA functionality is becoming more common in ASIC RFQs as
system and semiconductor companies seek longer lifetimes out of
their chip investments by being able to reprogram hardwired
accelerators as algorithms and protocols change. Flex Logix's EFLX
eFPGA is available in popular 40, 22, 28, 16, and 12 nm process
nodes and supports 1K - >300K LUT4 equivalents, which enables
design services companies to meet their customer's eFPGA needs.


 “We were delighted to work with GUC who provided ASIC services
and integrated our EFLX eFPGA in InferX X1,” said Geoff Tate, CEO
of Flex Logix. “EFLX IP was architected to be extremely easy to
integrate and program for any eFPGA size requirement. This is
another example of an ASIC design company achieving first time
working silicon using EFLX IP for the first time.” 


“We are glad to have the opportunity to work with Flex Logix and
integrate their eFPGA IP in InferX X1,” said Ken Chen, President
of Global Unichip. “To accommodate the expected increase in ASIC
demand, GUC is providing industry-leading design service together
with advanced package design capabilities for TSMC's various
process technologies. With proven design expertise and a track
record of manufacturing excellence, GUC will enable customers to
deliver differentiated and competitive high-performance,
power-efficient ASIC products. Our deep hands-on expertise in chip
design and manufacturing excellence ensure the first-time silicon
success. We look forward to working with Flex Logix for InferX X1
production ramp-up, as well as with our mutual customers to enable
future ASICs with RTL reconfigurability.” 


Flex Logix offers two eFPGA cores: the EFLX1K core for small,
low-cost applications and the EFLX4K for applications requiring large
amounts of reconfigurable logic. The EFLX1K has 1K
4-input-equivalent LUTS and the EFLX4K has 4K
4-input-equivalent-LUTs. Both cores are available in all logic or a
combination of logic and DSP multiplier-accumulators for DSP and
artificial intelligence (AI) applications. EFLX cores can be tiled together
to make larger arrays to support applications needing more LUTs as
required, up to 7x7 with any mix of logic and DSP cores. 


The EFLX arrays are programmed using VHDL or Verilog. The EFLX
Compiler takes the output of a synthesis tool such as Synopsys
Synplify® and does packing, placement, routing, timing, and
bitstream generation. The bitstream, when loaded into the array,
programs it to execute the desired RTL. 


About GUC

GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC Leader, who
provides the semiconductor industry with leading IC implementation
and SoC manufacturing services, using advanced process and
packaging technology. Based in Hsin-chu Taiwan, GUC has developed
a global reputation with a presence in China, Europe, Japan, Korea,
and North America. GUC is publicly traded on the Taiwan Stock
Exchange under the symbol 3443. For more information,
visit https://www.guc-asic.com 


About Flex Logix        

Flex Logix provides industry-leading solutions for making flexible chips
and accelerating neural network inferencing. Its InferX X1 is the
industry's fastest and most-efficient AI edge inference accelerator that
will bring AI to the masses in high-volume applications, surpassing
competitor's performance at 1/7th size and 10x lower price. Flex
Logix's eFPGA platform enables chips to be flexible to handle changing
protocols, standards, algorithms, and customer needs and to implement
reconfigurable accelerators that speed key workloads 30-100x compared
to processors. Flex Logix is headquartered in Mountain View, California.
For more information, visit https://flex-logix.com 


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