Concurrent die/package planning and route optimization


Key Benefits

   •   Optimizes device and system performance

   •   Significantly shortens time to converge on optimal die/package interface

   •   Anticipates and avoids downstream issues with early design planning
  

Cadence® OrbitIO™ Interconnect Designer helps your design team quickly assess
and plan connectivity between the die and package in context of the full
system—all within a single-canvas multi-fabric environment. It’s ideal for system
architects or anyone responsible for developing the die-to-package interface and
coming up with the optimal combination of bump/ball configurations and net
assignments. OrbitIO Interconnect Designer helps semiconductor companies evaluate
route feasibility of the package, as well as develop and communicate a route plan to
their package design resources.


 
  
 
Unlike an iterative spreadsheet-based approach, OrbitIO Interconnect Designer lets
you make or refine decisions, then immediately visualize and evaluate the impact on
adjacent fabrics, all within a single tool. In doing so, it significantly reduces iterations
between your silicon and package design teams as they try to converge on a solution.
OrbitIO interconnect designer helps you better qualify the design definition prior to
implementation, leading to more predictable system cost, performance, and product
delivery.


Features/Benefits

   •   Parametric definition and editing of bump and ball pad patterns

   •   Automatic ratio-driven signal, power, and ground pin allocation

   •   Pin-based floorplanning of critical nets and interfaces

   •   Automatic net mapping and propagation across fabrics, including differential pairs

   •   Route bundles and flow planning for detailed connection assignment

   •   Rapid route feasibility analysis to evaluate escape routes of bumps and balls

   •   Direct integration with Cadence SiP Layout XL (SIP-XL) to exchange planning
        data and accelerate implementation

   •   Utilize key PCB components to influence package ball pad assignments

   •   Better predict cost and performance using well-qualified design definitions

   •   Quickly generate design abstractions in response to marketing feasibility studies

   •   Clearly communicate design intent and route plan to external design resources

   •   Design tool compatibility with outsourced assembly and test (OSAT) providers